No. |
豁免内容 |
豁免项 |
范围及到期日 |
1 |
Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): 单端(小)荧光灯所实用的汞含磷量不允许超越(每盏灯): |
Hg |
|
1(a) |
For general lighting purposes < 30 W: 5 mg 大部分灯饰照明适用范围<30W:5 mg |
Hg |
到期了:2011/12/31 3.5mg:2012/01/01~2012/12/31 2.5mg:2013/01/01起 |
1(b) |
For general lighting purposes ≥ 30 W and < 50 W: 5 mg 普通照明系统应用≥30W且<50W:5 mg |
Hg |
期满:2011/12/31 3.5mg:2012/01/01起 |
1(c) |
For general lighting purposes ≥ 50 W and < 150 W: 5 mg 般灯饰照明主要用途≥ 50 W and < 150 W: 5 mg |
Hg |
|
1(d) |
For general lighting purposes ≥ 150 W: 15 mg 一样 灯具照明贷款用途≥ 150 W: 15 mg |
Hg |
|
1(e) |
For general lighting purposes with circular or square structural shape and tube diameter ≤17 mm 通常情况灯光的主要用途是什么,为方通或方通机构,且管道直径≤17 mm |
Hg |
期满:2011/12/31 7mg:2012/01/01起 |
1(f) |
For special purposes: 5 mg 非常规领域: 5 mg |
Hg |
|
2(a) |
Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): 应用于般照明工程的双端平行线型灾光灯,所利用的汞纯度不恰超过了(每盏灯): |
Hg |
|
2(a)1 |
Tri-band phosphor with normal lifetime and a tube diameter > 9 mm (e.g. T2): 5 mg 似的生命的三光波波长荧光灯,其公称直径> 9 mm (举个例子 T2): 5 mg |
Hg |
超期:2011/12/31 4mg:2012/01/01起 |
2(a)2 |
Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 5 mg 通常生命周期的三光的波长荧光灯,其管经≥ 9 mm 且 ≤ 17 mm (比如 T5): 5 mg |
Hg |
过期:2011/12/31 3mg:2012/01/01起 |
2(a)3 |
Tri-band phosphor with normal lifetime and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8): 5 mg 基本上耐用度的三光的波长荧光灯,其管子规格> 17 mm and ≤ 28 mm (列举 T8): 5 mg |
Hg |
超期:2011/12/31 3.5mg:2012/01/01起 |
2(a)4 |
Tri-band phosphor with normal lifetime and a tube diameter > 28 mm (e.g. T12): 5 mg 基本生存期的三激发光谱荧光灯,其管经 > 28 mm (随后T12): 5 mg |
Hg |
超期:2012/12/31 3.5mg:2013/01/01起, |
2(a)5 |
Tri-band phosphor with long lifetime (≥ 25 000 h): 8 mg 长平均寿命(≥ 25 000 h)的三激发光谱荧光灯: 8 mg |
Hg |
期满:2011/12/31 5mg:2012/01/01起 |
2(b) |
Mercury in other fluorescent lamps not exceeding (per lamp): 其他的荧光灯,所利用的汞分子量不恰超(每盏灯): |
Hg |
|
2(b)1 |
Linear halophosphate lamps with tube > 28 mm (e.g. T10 and T12): 10 mg 蹭蹭蹭蹭型磷酸荧光灯,其外径> 28 mm (譬如T10 和 T12): 10 mg |
Hg |
期满:2012/04/13 |
2(b)2 |
Non-linear halophosphate lamps (all diameters): 15 mg 非线路型磷酸荧光灯(所有通径): 15 mg |
Hg |
超期:2016/04/13 |
2(b)3 |
Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9) 非渐渐型三吸光度荧光灯,其管子规格> 17 mm (列如 T9) |
Hg |
豁免续签:2011/12/31 15mg:2012/01/01起 |
2(b)4 |
Lamps for other general lighting and special purposes (e.g. induction lamps) 另一个似的照明设备或唯一性作用的灯(如感應灯) |
Hg |
豁免收回:2011/12/31 15mg:2012/01/01起 |
3 |
Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): 特俗领域的冷阴离子荧光灯(CCFL)和外部链接电极片荧光灯(EEFL),所用到的汞含量的只能超越(每盏灯): |
Hg |
|
3(a) |
Short length (≤ 500 mm) 较短长度(≤ 500 mm) |
Hg |
豁免收回:2011/12/31 3.5mg:2012/01/01起 |
3(b) |
Medium length (> 500 mm and ≤ 1 500 mm) 中级粗度 (> 500 mm and ≤ 1 500 mm) |
Hg |
豁免过期:2011/12/31 5mg:2012/01/01起 |
3(c) |
Long length (> 1 500 mm) 较长间距(> 1 500 mm) |
Hg |
豁免续签:2011/12/31 13mg:2012/01/01起 |
4(a) |
Mercury in other low pressure discharge lamps (per lamp) 其他高压低压尖端放电灯中汞的含量(每盏灯) |
Hg |
豁免到期日:2011/12/31 15mg:2012/01/01起 |
4(b) |
Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60: 通常情况灯光种类的高压电钠(水汽)灯, 其演色性指标值Ra>60, 所安全使用的汞水分含量不恰超(每盏灯): |
Hg |
|
4(b)1 |
P ≤155 W |
Hg |
豁免到期日:2011/12/31 30mg:2012/01/01起 |
4(b)2 |
155 W < P ≤ 405 W |
Hg |
豁免续签:2011/12/31 40mg:2012/01/01起 |
4(b)3 |
P > 405 W |
Hg |
豁免过期:2011/12/31 40mg:2012/01/01起 |
4(c) |
Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): 一半照明设备不同的用途的多种高压低压钠(水蒸汽)灯,所利用的汞纯度禁止高于(每盏灯): |
Hg |
|
4(c)1 |
P ≤155 W |
Hg |
豁免延期:2011/12/31 25mg:2012/01/01起 |
4(c)2 |
155 W < P ≤ 405 W |
Hg |
豁免续签:2011/12/31 30mg:2012/01/01起 |
4(c)3 |
P > 405 W |
Hg |
豁免延期:2011/12/31 40mg:2012/01/01起 |
4(d) |
Mercury in High Pressure Mercury (vapour) lamps (HPMV) 高电压汞(水蒸气)灯(HPMV)中实用的汞含量的 |
Hg |
到期了:2015/04/13 |
4(e) |
Mercury in metal halide lamps (MH) 含卤化物合金钢 (MH)的灯,所的使用汞的量 |
Hg |
|
4(f) |
Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex 一些未在这种附表中谈及的特俗不同的用途尖端放电灯,其中含的汞 |
Hg |
|
5(a) |
Lead in glass of cathode ray tubes 阴离子X射线分液漏斗的窗玻璃可含铅量 |
Pb |
|
5(b) |
Lead in glass of fluorescent tubes not exceeding 0,2 % by weight 荧光灯的夹层玻璃含铅量不可以少于体积的0,2 % |
Pb |
|
6(a) |
Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0,35 % lead by weight 铅使用在生产加工适用范围的建筑钢材及热浸镀锌钢中,作为一个合金材料重元素组成,其含铁最低不得不不超0,35 % |
Pb |
|
6(b) |
Lead as an alloying element in aluminium containing up to 0,4 % lead by weight 铅使用在铝锰钢,作锰钢风格产品之一,其水平至高不达到 0,4 % |
Pb |
|
6(c) |
Copper alloy containing up to 4 % lead by weight 铜镍钢里面含铅量,非常高不恰不超4.0 % |
Pb |
|
7(a) |
Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) 高沸点类的焊锡,其什么食物含硒的铅豁免(如铅为基低的镍钢,其铅含量的不小于85%) |
Pb |
|
7(b) |
Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications 产品器、会自动储存装制和阵列机系统装制中运行的焊锡,或架线网机常用到的如电开关,无线信号装制,发送装制或中国联通网机什么和什么采用到的焊锡,其焊锡中的铅 |
Pb |
|
7(c)1 |
Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 铅使用在电子无线产品及电子无线零件的波璃或陶瓷厂家(介电瓷砖,滤波电容以外)。假如:光电探测器设施, 或安全玻璃, 或淘瓷塑料建筑材料 |
Pb |
|
7(c)2 |
Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 固定工作电压为125V AC或250V DC或许更快的电解电容,内部的介电淘瓷中的铅 |
Pb |
|
7(c)3 |
Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 额定功率端电压高于125V AC或250V DC的滤波电容,于外的介电陶瓷图片中的铅 |
Pb |
豁免延期:2013/01/01 豁免比率:2013/01/01当年校园推广在领域上的电子为了满足电子时代发展的需求,主轴电机厂品的紧急加工零件 |
7(c)-IV |
Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors压阻陶瓷图片图片介电陶瓷图片图片的材料的电阻器的铅,该电阻器为集成型电线或分立半导的包含区域 |
Pb |
|
9(b) |
Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications 含制热剂的中用采暖,空气流通,制热的收缩机,其滑动轴承金属外壳和衬套所选择的铅. |
Pb |
|
11(a) |
Lead used in C-press compliant pin connector systems C-press因势利导针接连体系里面 用到的铅 |
Pb |
豁免区域:2010/09/24当年投放广告在销售市场上的微电子电动机车辆的应急配件 |
11(b) |
Lead used in other than C-press compliant pin connector systems 除C-press外的切合针接触系统软件中施用的铅. |
Pb |
豁免届满:2013/01/01 豁免范围图:2013/01/01去年校园推广策略在卖场上的手机三相电机软件的紧急零配件 |
12 |
Lead as a coating material for the thermal conduction module C-ring 导热性模组C-ring中的涂膜相关材料所适用的铅 |
Pb |
过后豁免:2010/09/24前年投放在市场上的电子电机产品的备用零件 |
13(a) |
Lead in white glasses used for optical applications 光电技术技术应用的暗红色波璃中的铅 |
Pb |
|
13(b) |
Cadmium and lead in filter glasses and glasses used for reflectance standards 滤光夹丝夹丝玻璃及反射层标准规范用的夹丝夹丝玻璃组成的铅 |
Pb |
|
14 |
Lead in solders consisting of more than two elements for the connection between the pins and the package of microproprocessors with a lead content of more than 80 % and less than 85 % by weight 应用在引脚和封装形式后微加工器当中连结的焊锡,若此焊锡为2种之内的无素组成部分,则其含铅量量可对应80%~85%. |
Pb |
豁免延期:2011/01/01 以来豁免:2010/09/24去年精准投放在股票市场上的电子为了满足电子时代发展的需求,伺服电机商品的预留零件加工 |
15 |
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circ, uit flip chip packages 融合集成运放倒装处理存储芯片二极管封装中半导处理存储芯片及媒体中建成安全可靠相连接选用的铅 |
Pb |
|
16 |
Lead in linear incandescent lamps with silicate coated tubes 线型钨丝灯中灯管若有涂抹硅酸盐,则铅可豁免 |
Pb |
豁免延期:2013/12/01 |
17 |
Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications 用到技术复印生产设备的承载力充放灯(HID)中使用作促进的卤化物铅 |
Pb |
|
18(a)
|
Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
特殊用途的放电灯,例如用于含二氮化合物的电子翻印、平板印刷、捕虫灯、光化学或树脂硬化过程,其中含有磷,例如SMS ((Sr,Ba)2MgSi2O7:Pb) ,则放电灯中的荧光粉,其铅作为触发源,铅含量≤1%。
|
Pb |
豁免续期:2011/01/01 |
18(b) |
Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) 防曝晒的发出电灯,这其中含有磷,列如 BSP (BaSi2O5:Pb) ,则蓄电池放电灯中的荧光粉,其铅对于引起源,铅含量≤1%。 |
Pb |
|
19
|
Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)
铅作为主要汞齐合金的特定成分(如PbBiSn-Hg和PbinSg-Hg),且此汞齐作为主要汞齐,或如PbSn-Hg用于辅助汞齐中,且这些汞齐使用于紧凑型节能灯(ESL)中,则可含铅
|
Pb |
豁免届满:2011/06/01 |
20
|
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)
液晶显示器(LCD)中用于保护平面荧光灯前后支撑物用的玻璃中的氧化铅
|
Pb |
豁免到期日:2011/06/01 |
21 |
Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses 适用硼硅酸盐窗玻璃瓷漆的印墨包含的铅和镉 |
Pb,Cd |
|
23 |
Lead in finishes of fine pitch components other than connectors with a pitch of 0,65 mm and less 安全距离为0.65mm或更小的细间隔距离组件(连结件排除),所选用的铅 |
Pb |
豁免依据:2010/09/24当年校园推广在市面 上的微电子交流接触器成品的预备配件 |
24 |
Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors 通孔盘状友好面阵列工业陶瓷四层电阻器中的焊料,所操作的铅 |
Pb |
|
25 |
Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring 界面减压反射式网上发射卫星显示信息器(SED)的主件(特别是在是封严磨砂玻璃窗及磨砂玻璃窗环)中的脱色铅 |
Pb |
|
26
|
Lead oxide in the glass envelope of black light blue lamps
浅蓝黑灯管(BLB)玻璃外罩所含的氧化铅
|
Pb |
豁免到期了:2011/06/01 |
27
|
Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers
在大功率扬声器(设计在125dB SPL或以上使用数小时)中作为转换器焊料的铅合金
|
Pb |
豁免期满:2010/09/24 |
29 |
Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC 控制台命令69/493/EEC126邮件I(第1、2、3和4类)中表述的白水晶窗户玻璃中的铅 |
Pb |
|
31 |
Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting) 无汞平板等荧光灯内点焊用料中的铅(举列中用lcd屏体现器、设计的概念或化学工业采光) |
Pb |
|
32 |
Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes 用作氩和氪脉冲光管窗体应用程序手工制造的胶封釉料所适用的氧化反应铅 |
Pb |
|
33 |
Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers 内径100μm的细铝线和超过直劲100μm的电力公司配电变压器中的焊料所食用的铅; |
Pb |
|
34 |
Lead in cermet-based trimmer potentiometer elements 金属材料瓷砖质的调整电势差器中的铅含铁 |
Pb |
|
37 |
Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body 以硼酸锌夹层玻璃体为知识基础的高电压场效应管的塑料电镀层的铅水平 |
Pb |
|
9 |
Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution 吸收的作用式四门冰箱中碳素钢一系列闭式冷却塔系统上涂到的防腐处理蚀剂,其安全使用的六价铬不可以高达一系列闭式冷却塔液的0.75%. |
Cr(VI) |
|
8(a) |
Cadmium and its compounds in one shot pellet type thermal cut-offs 代替温湿度保险金丝中的镉和其有机化合物 |
Cd |
豁免收回:2012/01/01 豁免条件:2012/01/01上一年投置在卖场上的手机主轴电机企业产品的预备元器件 |
8(b) |
Cadmium and its compounds in electrical contacts 智能电子接触点中的镉下列不属于类化合物 |
Cd |
|
30 |
Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more 音压在100噪音分贝这些的大工率杨声器中,衔接音圈换算器电导体与电器/机戒的焊料所操作的镉合金属 |
Cd |
|
38 |
Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide 用空气腐蚀铍连入铝合金成的厚膜浆料中镉和空气腐蚀镉的成分 |
Cd |
|
39 |
Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state illumination or display systems 用在固体照明工作或表现操作系统中的色泽更换II - VI族变色场效应管(小于等于10 ug/mm2的放光空间),所用到的镉 |
Cd |
豁免续期:2014/07/01 |
40 |
Cadmium in photoresistors for analogue optocouplers applied in professional audio equipment 专业的声频系统中选择的虚拟仿真光耦合电路器中的光敏阻值器中的镉 |
Cd |
豁免续签:2013/12/31 |